{"product_id":"9781032095547","title":"3D Integration in VLSI Circuits : Implementation Technologies and Applications (Devices, Circuits, and Systems)","description":"\u003cp\u003eThe goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":46043011481679,"sku":"00000_00000_00000_00000","price":2764.63,"currency_code":"TWD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0672\/9174\/2287\/files\/9781032095547-1.jpg?v=1784950824","url":"https:\/\/kinokuniya.com.tw\/products\/9781032095547","provider":"Books Kinokuniya Taiwan","version":"1.0","type":"link"}