Spot, stop, and analyze IC device failure with this unique illustrated guide. Worth more than a thousand words, each illustration in "Failure- Free Integrated Circuit Packages" gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. "Failure-Free Integrated Circuit Packages" helps you: find, identify, and correct potential failures before they occur; improve device reliability; learn from case studies of IC package failure modes; quickly locate failures through visual comparisons; apply state-of-the-art failure analysis techniques; comprehend the physics behind the failure mechanism; and, understand the limitations of reliability testing and lifetime estimation.Inside, you'll find a practical and easy way to approach failure analysis of IC's in organic packages. Areas covered include: fundamentals of IC package technologies; reliability; physics and chemistry of failures in packaged devices; strategies for locating failures; failure analysis techniques; failure modes common in organic IC packages; and, emerging assembly materials for IC packaging.
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
