Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
Describing the different soldering methods in use today, this guide presents both their theory and practical applications. It covers the topics of cleaning, statistical quality control, through-hole and joining. The author relates all theory to practical, on-site situations.
